Our R&D center was established in 2006 to research and develop materials, new products, and high-valued products for customer satisfaction.
We have been developing technology-intensive products and expanding advancement in the fields of microwave shielding/absorbing and thermal interface materials by focusing on cutting-edge technology and core infrastructures.
We have been leading innovations in ultra-thin sheets for microwave absorbing, shield pad/gasket for automatic mounting (SMT), microwave absorbing band, and thermal conductive foam gasket/pad.
Our high-performance products such as highly permeable electromagnetic wave absorbing sheets complying with 5G frequency bands and high efficiency thermal conducting sheet, are supplied to many domestic and foreign companies.
We are doing our best to provide research and development services to meet customers' needs.
Our R&D Center focuses on the following fields.
EMI shielding & absorbing products to minimize mutual interference in various ranges of frequencies used by electronic devices.
High-efficiency ultra-thin thermal interface material to effectively solve heat problems caused by dense integration of electronic devices.
New products with low electric resistance, inherent softening, high elasticity, high adhesion, abrasion resistance for electromagnetic shielding and grounding functions.
Multifunctional materials and components for solving complexity due to dense integration of electronic devices and high frequency band material applicable to 5G wireless communication device.
08Patent for thin film FMCL manufacturing device and thin film FMCL manufacturing method
08Patent for gasket with excellent heat conduction and withstand voltage characteristics
06Development of hollow type TFG
03Development of heat-resistant foam gasket (125 degrees)
10Patent for low-cost assembly shield box with excellent electromagnetic shielding effect and light weight
10Development of roll-type EMI absorber
06Developed microwave absorber with a magnetic permeability of 300
05Development of heat-conducting gasket over 10W/mK that does not generate low molecular weight siloxane
11Introducing new ultra-thin product regarding to thermal interface material for mobile phone
06Development of a reflowable microwave absorber
12Patent of heat-conductive elastomer and heat/electric conductive elastomer technology capable of reflow soldering
09Development of high-performance microwave absorber with high permeability
06Developed ultra-high permeability electromagnetic wave absorbing sheet (Completed in 2016)
07Patent of ground foam gasket technology for surface mounting of electronic circuit board with mold core
07Patent of shield tent technology with excellent electromagnetic shielding effectiveness
07Completed the development of thermally conductive foam gasket and applied for domestic and international patent
02Developed electromagnetic wave absorbing band for cable and applied for domestic patent
10Started development of solar cell related substrate material
04Established a branch of R & D center in Seongju factory
08Developed shield pad capable of automatic mounting (SMT)
07Development of ultra-thin electromagnetic absorbing pad
10Establishment of R & D center
04Development of magnetic shielding thin plate for shield laminate
07Technology export of shield window production technology and equipment to S company in Japan
05Development of liquid conductive silicone rubber for electromagnetic shielding
