Research & Development

Our R & D center was established in 2006 to research and develop new materials, new products, and high value-added products for customer satisfaction.

We have been developing technology-intensive products and expanding competitiveness in electromagnetic shielding/absorbing and thermal interface materials by concentrating on cutting-edge technology and core infrastructures.


We have developed ultra-thin sheet for electromagnetic wave absorbing, shield pad/gasket for automatic mounting (SMT), electromagnetic wave absorbing band, and thermal conductive foam gasket/pad, as a catalyst for industrial technology innovation.


We have developed high performance components such as highly permeable electromagnetic wave absorbing sheet complying to 5G frequency bands and high efficiency thermal conducting sheet, supplying them to many domestic and foreign companies. We are doing our best to provide research and development service to meet customers' needs.


Our company is a technology-oriented company by developing new products that meet customers’ requirements in the industry of electromagnetic shielding/absorbing and thermal interface material.


We will focus on improving technological competitiveness of our main field of industry and establishing a creative R & D system for promising long-term growth in the future.



Major Research Fields

Our research center is focusing on the following fields with our core competence.


EMI Shielding & Absorbing Solution

Develop EMI shielding & absorbing products to minimize mutual interference in various frequencies used for various electronic device


Thermal Conduction Solution

Develop high-efficient ultra-thin thermal conductive material to effectively solve heat problems caused by high integration of electronic devices.

Electrical Conductivity Solution

Develop new products with low-resistance, inherent softtening, high elasticity, high adhesion, abrasion resistant for electromagnetic shielding and grounding functions.

Multi-functional Materials

Develop multifunctional materials and parts for solving complex problems due to high integration of electronic devices. Develop high frequency band material applicable to 5G wireless communication device.


Development Records

2010s
2018

11Introducing new ultra-thin product regarding to thermal interface material for mobile phone

2017

12Patent of heat-conductive elastomer and heat/electric conductive elastomer technology capable of reflow soldering

2014

06Developed ultra-high permeability electromagnetic wave absorbing sheet (Completed in 2016)

2013

07Patent of ground foam gasket technology for surface mounting of electronic circuit board with mold core

07Patent of shield tent technology with excellent electromagnetic shielding effectiveness

2012

07Completed the development of thermally conductive foam gasket and applied for domestic and international patent

02Developed electromagnetic wave absorbing band for cable and applied for domestic patent

2011

10Started development of solar cell related substrate material

04Established a branch of R & D center in Seongju factory

2010

08Developed shield pad capable of automatic mounting (SMT)

2000s
2007

07Development of ultra-thin electromagnetic absorbing pad

2006

10Establishment of R & D center

04Development of magnetic shielding thin plate for shield laminate

2004

07Technology export of shield window production technology and equipment to S company in Japan

2002

05Development of liquid conductive silicone rubber for electromagnetic shielding

2000

11Technology export of automatic gasket production for ground foam to T company in USA


Patents

We holds 14 domestic patents and 2 international patents by virtue of continuing R & D activities.


Domestic Patents

Patent Registration #
Conductive pad and Manufacturing method thereof Patent 10-1175346
Graphite sealed thermal conductive elastic gasket Patent 10-1228603
Thermal conductive foam gasket Patent10-1245164
Graphite sealed electrical / thermal conductive elastic gasket Patent10-1256397
Graphene-metal composite, heat / electro conductive foamed elastomer using the production method thereof Patent10-1270771
Electromagnetic wave absorbing band for a cable and the method for installing the same on a cable Patent10-1298963
Heat-conductive elastic parts with excellent heat transfer efficiency Patent10-1321578
Heat-conductive parts with excellent heat dissipation and thermal conductivity Patent10-1322618
Ground foam gasket for mounting an electronic circuit board having a molded core Patent10-1350223
Washing and drying equipment Patent 10-1404006
Thermal conductive elastomer that blocks the antenna effect by noise coupling Patent10-1503307
Shield tent with excellent electromagnetic shielding effectiveness Patent10-1514434
Thermal conductive elastomer capable of reflow soldering and manufacturing method thereof Patent10-1861244
Heat / electrically conductive elastomer with reflow soldering Patent10-1884930

International Patents

Patent Registration #
Thermal conductive elastic body (Thermal conductive elastomer) ZL 2013 8 0002971.3
Thermal conductive elastic body (Graphite sealed thermal conductive elastomer gasket) US 9,335,104 B2