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Overview
- Ground thermal foam gasket (Conductive TFG) is a product that has excellent heat dissipation (heat conduction) function and electromagnetic noise attenuation function by wrapping electrically conductive fabric to the existing thermal foam gasket (TFG).
- By installing between the heat source such as CPU, LED, PCB, etc. and the heat sink (heat sink, metal case, etc.), it can quickly transfer heat from the heat source, and at the same time attenuate electromagnetic noise through the excellent electrically conductive fabric.
Features
- Simultaneous implementation of heat dissipation + grounding function
- Thermal conductivity of over 2 W/mK realized
- Conductive fabric with excellent electrical conductivity used (resistance less than 0.1 Ω)
- Lightweight and cushioned by using a soft sponge
- Can be processed into various shapes according to customer requirements
Details
Product structure
| Number | Material |
|---|---|
| 1 | Electrically conductive fabric |
| 2 | Graphite sheet |
| 3 | Heat-resistant foam |
| 4 | Adhesive tape |
Specifications
| Properties | Unit | Typical Value | Test Method |
|---|---|---|---|
| Thermal conductivity | W/mK | > 2 | ASTM C 518 ASTM E 1530-06 |
| Z-axis resistance | Ω | < 0.1 | ESQ-612-02 |
| Operating temperature | °C | < 125 | ESQ-612-20 |
| Recommended compression rate | % | 25 | ESQ-612-27 |
| Compression recovery rate | % | > 90 | ESQ-612-26 |
| Environmental issue | - | RoHS-compliant, Halogen free | |
Comparison with the existing TFG
Thermal conductive performance is equal to that of the existing TFG, and the resistance is less than 0.1 Ω.
| The existing TFG | Ground TFG | |
|---|---|---|
| Pictures |  |
 |
| Specimen | Graphite 1 layer, 50mm x 50mm x 13T | |
| Average Reaching Time* | 82~84 sec. | 80~82 sec. |
| Saturation temperature[℃] | 62.0℃ | 61.7℃ |
| Z-axis resistance[Ω] | - | 0.03~0.04 (25% compression) |
* Average Reaching Time:
Thermal transferring performance comparison of TFG and Thermal Ground Gasket
(Specimens of the same size, W50*L50*T13mm)
1) Measure the temperature change after pressing the specimen 20% between the heating plates.
2) After heating the lower heating plate to 150℃ and laying the specimen on the lower heating plate, measure the time until the thermal sensor of the upper heating plate rises from the initial setting value of 40℃ to 60℃.
Applications
By attaching it between the heat source and the heat sink/metal case, you can see the effect of heat dissipation (heat conduction) and suppression of electromagnetic noise at the same time.
Product Support
Part Number
| # | Code | Examples |
|---|---|---|
| (1) | Product code | TFG1: Graphite 1 layer TFG2: Graphite 2 layers |
| (2) | Outer layer | C: Conductive fabric |
| (3) | Width (W) | 280: 28.0mm |
| (4) | Length (L) | 300: 30.0mm |
| (5) | Thickness (T) | 080: 8.0mm |
| (6) | Adhesive tape | A: T338, B: T324 |
Documentation
No data.